Hi-tech packaging event opens in Germany

Printed electronics and ‘smart’ packaging will be the focus of a two-day conference opening in Dresden, Germany, today.


The conference and exhibition will host 600 attendees including international brands Sony, Seiko Epson, Samsung, Philips, Motorola, Hewlett-Packard, FujiFilm Dimatix and Du Pont, among others.


Packaging designers will be able to get insights into the latest developments, devices, materials and production technologies such as smart skin patches, and photovoltaics beyond silicon.


Matthew Falla, founder of Osmotronic, is currently working with printed electronics to develop secondary-use packaging for Nokia and Motorola


‘I think printed electronics is going to come out in high-end premium goods. For applications like food packaging, it might be that your magnum bottle of champagne sparkles and changes or has electronic visual effects. But there also needs to be a justification for putting electronics on to cardboard because of the cost and effort in its development,’ says Falla.


Falla says that this can be overcome by adding function to extend the useful life of packaging. He is currently developing phone packaging that can double up as a dock for a phone, shifting the packaging away from disposability.


The fourth annual Printed Electronics Europe conference, organised by Idtechex, will be held at the Maritim Hotel & International Congress Center, Dresden, Germany.


For further information, visit www.idtechex.com/peeurope.

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